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Ledn, a Bitcoin lending platform, has received a significant boost with Tether's strategic investment, aiming to expand its Bitcoin-backed lending services worldwide. This move comes as Bitcoin lending gains traction, with the cryptocurrency's value and adoption increasing. The investment from Tether, a stablecoin issuer, further strengthens Ledn's position in the market.

Tether, a leading stablecoin provider, has partnered with Ledn, a Bitcoin-backed lending platform, to accelerate global crypto lending and liquidity access. This strategic investment aims to capture the rising demand for Bitcoin-backed loans.

At the OCP Summit, Axiado teamed up with Jabil to deliver AI-driven security for modular servers, while Arm redefined AI infrastructure through open chiplet collaboration. Foxconn showcased high-speed and cooling innovations, and Intel announced plans to launch the Crescent Island AI server GPU in 2026. Meta warned about power scarcity threatening AI scaling ambitions, with AI data centers embracing high-voltage power and liquid cooling by 2025. ASUS unveiled AI Factory and next-gen servers with NVIDIA HGX B300 systems at OCP 2025, while AMD highlighted x86 advisory progress, ROCm expansion, and ESUN membership. Pegatron and MiTAC Computing presented next-gen AI and HPC server platforms, and Rittal introduced the MGX™ Architecture Rack. InPsytech showcased 3nm UCIe 3.0 technology, accelerating innovation in the chiplet ecosystem. Nvidia brought open-source innovation to AI factories, and Alcor Micro presented its latest Arm-based CPU platform "Mobius100 (CSS V3)" at the OCP Global Summit 2025. AMD debuted the Helios rack-scale AI hardware platform, promising easier serviceability and 50% more memory than Nvidia's Vera Rubin. The OCP inaugurated a new project stream for scale-up data center interconnect, and XConn Technologies and MemVerge demonstrated CXL memory pool for KV Cache using NVIDIA Dynamo for breakthrough AI workload performance. Meta provided updates on its AI fabric ambitions at the OCP meet.

At the OCP Summit, Axiado teamed up with Jabil to deliver AI-driven security for modular servers, while Arm redefined AI infrastructure through open chiplet collaboration. Foxconn showcased high-speed and cooling innovations, and Intel announced plans to launch the Crescent Island AI server GPU in 2026. Meta warned about power scarcity threatening AI scaling ambitions, with AI data centers embracing high-voltage power and liquid cooling by 2025. ASUS unveiled AI Factory and next-gen servers with NVIDIA HGX B300 systems at OCP 2025, while AMD highlighted x86 advisory progress, ROCm expansion, and ESUN membership. Pegatron and MiTAC Computing presented next-gen AI and HPC server platforms, and Rittal introduced the MGX™ Architecture Rack. InPsytech showcased 3nm UCIe 3.0 technology, accelerating innovation in the chiplet ecosystem. Nvidia brought open-source innovation to AI factories, and Alcor Micro presented its latest Arm-based CPU platform "Mobius100 (CSS V3)" at the OCP Global Summit 2025. AMD debuted the Helios rack-scale AI hardware platform, promising easier serviceability and 50% more memory than Nvidia's Vera Rubin. The OCP inaugurated a new project stream for scale-up data center interconnect, and XConn Technologies and MemVerge demonstrated CXL memory pool for KV Cache using NVIDIA Dynamo for breakthrough AI workload performance. Meta provided updates on its AI fabric ambitions at the OCP meet.