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At the OCP Summit, Axiado teamed up with Jabil to deliver AI-driven security for modular servers, while Arm redefined AI infrastructure through open chiplet collaboration. Foxconn showcased high-speed and cooling innovations, and Intel announced plans to launch the Crescent Island AI server GPU in 2026. Meta warned about power scarcity threatening AI scaling ambitions, with AI data centers embracing high-voltage power and liquid cooling by 2025. ASUS unveiled AI Factory and next-gen servers with NVIDIA HGX B300 systems at OCP 2025, while AMD highlighted x86 advisory progress, ROCm expansion, and ESUN membership. Pegatron and MiTAC Computing presented next-gen AI and HPC server platforms, and Rittal introduced the MGX™ Architecture Rack. InPsytech showcased 3nm UCIe 3.0 technology, accelerating innovation in the chiplet ecosystem. Nvidia brought open-source innovation to AI factories, and Alcor Micro presented its latest Arm-based CPU platform "Mobius100 (CSS V3)" at the OCP Global Summit 2025. AMD debuted the Helios rack-scale AI hardware platform, promising easier serviceability and 50% more memory than Nvidia's Vera Rubin. The OCP inaugurated a new project stream for scale-up data center interconnect, and XConn Technologies and MemVerge demonstrated CXL memory pool for KV Cache using NVIDIA Dynamo for breakthrough AI workload performance. Meta provided updates on its AI fabric ambitions at the OCP meet.

Broadcom joins OCP's ESUN initiative after leaving UALink's board, with NVIDIA and AMD added to OCP's board, indicating a shift in the organization's leadership. ASUS unveils AI Factory and next-gen servers with NVIDIA HGX B300 systems at OCP 2025, demonstrating the event's focus on AI advancements. Microsoft expands its AI infrastructure by 2 GW, cuts GPT-4 costs by 93%, and supports new OCP power and cooling standards. The OCP Global Summit 2025 sees participation from various tech giants like AMD, Arm, and Nvidia, deepening the event's AI focus.